US PATENT SUBCLASS 216 / 51
.~ Mask resist contains inorganic material

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


216 /   HD   ETCHING A SUBSTRATE: PROCESSES

41  DF  MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST) {9}
51.~ Mask resist contains inorganic material

DEFINITION

Classification: 216/51

Mask resist contains inorganic material:

(under subclass 41) Process wherein the resist material is inorganic and includes material in an elemental state.

(1) Note. See Glossary for a definition of the term Inorganic.

SEE OR SEARCH THIS CLASS, SUBCLASS:

41, for masking material where the patent disclosure is silent as to its chemical nature.