US PATENT SUBCLASS 204 / 298.13
.~.~.~.~ Target composition

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.02  DF  .~.~ Coating {13}
298.12  DF  .~.~.~ Specified target particulars {1}
298.13.~.~.~.~ Target composition

DEFINITION

Classification: 204/298.13

Target composition:

(under subclass 298.12) Apparatus wherein the composition of the target is specified.