US PATENT SUBCLASS 204 / 192.37
.~.~.~.~ Silicon containing

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.32  DF  .~.~ Sputter etching {3}
192.35  DF  .~.~.~ Etching specified material {2}
192.37.~.~.~.~ Silicon containing

DEFINITION

Classification: 204/192.37

Silicon containing:

(under subclass 192.35) Processes wherein the material being etched is organic material.