US PATENT SUBCLASS 204 / 192.35
.~.~.~ Etching specified material

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.32  DF  .~.~ Sputter etching {3}
192.35.~.~.~ Etching specified material {2}
192.36  DF  .~.~.~.~> Organic
192.37  DF  .~.~.~.~> Silicon containing

DEFINITION

Classification: 204/192.35

Etching specified materials:

(under subclass 192.32) Processes wherein the material being etched comprises a designated chemical composition (DCC).