US PATENT SUBCLASS 148 / 282
.~.~ Metal substrate contains elemental copper or alloy thereof

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


148 /   HD   METAL TREATMENT

95  DF  PROCESS OF MODIFYING OR MAINTAINING INTERNAL PHYSICAL STRUCTURE (I.E., MICROSTRUCTURE) OR CHEMICAL PROPERTIES OF METAL, PROCESS OF REACTIVE COATING OF METAL AND PROCESS OF CHEMICAL-HEAT REMOVING (E.G., FLAME-CUTTING, ETC.) OR BURNING OF METAL {17}
240  DF  .~ Processes of coating utilizing a reactive composition which reacts with metal substrate or composition therefore {12}
282.~.~ Metal substrate contains elemental copper or alloy thereof

DEFINITION

Classification: 148/282

Metal substrate contains elemental copper or alloy thereof:

(under subclass 240) Subject matter wherein the metal substrate contains elemental copper or an alloy thereof.

(1) Note. This subclass provides for a copper containing substrate regardless of the amount of copper.

(2) Note. The copper need not be involved in the reaction process. It is sufficient if copper is merely present in the metal substrate.