US PATENT SUBCLASS 148 / 269-- .~.~.~ Metal substrate contains elemental Ti, Zr, Hf, Cu, Ta, or Th or alloy thereof

US PATENT SUBCLASS 148 / 269
.~.~.~ Metal substrate contains elemental Ti, Zr, Hf, Cu, Ta, or Th or alloy thereof

Current as of: June, 1999
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148 /	HD	METAL TREATMENT

95	DF	PROCESS OF MODIFYING OR MAINTAINING INTERNAL PHYSICAL STRUCTURE (I.E., MICROSTRUCTURE) OR CHEMICAL PROPERTIES OF METAL, PROCESS OF REACTIVE COATING OF METAL AND PROCESS OF CHEMICAL-HEAT REMOVING (E.G., FLAME-CUTTING, ETC.) OR BURNING OF METAL {17}
240	DF	.~ Processes of coating utilizing a reactive composition which reacts with metal substrate or composition therefore {12}
243	DF	.~.~ Liquid reactive coating composition utilized {16}
269		.~.~.~ Metal substrate contains elemental Ti, Zr, Hf, Cu, Ta, or Th or alloy thereof

DEFINITION

Classification: 148/269

Metal substrate contains elemental Ti, Zr, Hf, Cu, Ta, or Th or alloy thereof:

(under subclass 243) Subject matter wherein a liquid composition is applied to a metal substrate containing at least one elemental or alloyed form of Ti, Zr, Hf, Cu, Ta or Th and reacts therewith.

(1) Note. This subclass provides for a metal substrate containing any of the above elements regardless of the amounts of those elements therein.

(2) Note. The particular elements enumerated above need not be involved in the reaction process. It is sufficient for purposes of the subclass if the particular element is present in the substrate.