US PATENT SUBCLASS 505 / 411
.~.~ Utilizing plasma etching or sputter etching

Current as of: June, 1999
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505 /   HD   SUPERCONDUCTOR TECHNOLOGY: APPARATUS, MATERIAL, PROCESS

300  DF  PROCESSES OF PRODUCING OR TREATING HIGH TEMPERATURE (Tc GREATER THAN 30 K) SUPERCONDUCTOR MATERIAL OR SUPERCONDUCTOR CONTAINING PRODUCTS OR PRECURSORS THEREOF {24}
410  DF  .~ With material removal by etching, laser ablation, or mechanical abrasion {3}
411.~.~ Utilizing plasma etching or sputter etching

DEFINITION

Classification: 505/411

Utilizing plasma etching or sputter etching:

(under subclass 410) Process wherein material is removed (a) by chemical action of ionized gases in an equilibrium of positive or negative ions or chemical action of ionized gases in a vacuum (i.e., cold plasma), or (b) through momentum transfer elimination caused by the collision of ionized gases with the substrate.