438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
FOR 385 | DF | INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9} |
FOR 393 | .~ Of polycrystalline semiconductor material on substrate (437/233) {1} | |
FOR 394 | DF | .~.~> Semiconductor compound or mixed semiconductor material (437/234) |