US PATENT SUBCLASS 438 / FOR 386
.~ Substrate dicing (437/226)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

FOR 385  DF  INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9}
FOR 386.~ Substrate dicing (437/226) {1}
FOR 387  DF  .~.~> With a perfecting coating (437/227)

DEFINITION

Classification: 438/FOR.386

Substrate dicing:

Foreign art collection for processes including the step cutting the substrate by any manner, e.g., sawing, etching, etc.