438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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FOR 340 | DF | MAKING OR ATTACHING ELECTRODE ON OR TO SEMICONDUCTOR, OR SECURING COMPLETED SEMICONDUCTOR TO MOUNTING OR HOUSING (437/180) {13} |
FOR 356 | | .~ Forming electrode of alloy or electrode of a compound of Si (Silicon) (437/196) {4} |
FOR 357 | DF | .~.~> Al (Aluminum) alloy (437/197) {2} |
FOR 360 | DF | .~.~> Silicide of Ti (Titanium), Zr (Zirconium), Hf (Hafnium), V (Vanadium), Nb (Niobium), Ta (Tantalum), Cr (Chromium), Mo (Molybdenum), W (Tungsten), (437/200) |
FOR 361 | DF | .~.~> Of plantinum metal group Ru (Ruthenium), Rh (Rhodium), Pd (Palladium), Os (Osmium), Ir (Iridium), Pt (Platinum) (437/201) |
FOR 362 | DF | .~.~> By fusing metal with semiconductor (alloying) (437/202) |