US PATENT SUBCLASS 438 / FOR 124
.~.~ Sequential application of etchant material (156/650.1)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

983  DF  ZENER DIODES {1}
FOR 100  DF  .~ Etching of semiconductor precursor, substrates, and devices used in an electrical function (156/625.1) {17}
FOR 124.~.~ Sequential application of etchant material (156/650.1) {1}
FOR 125  DF  .~.~.~> Sequentially etching the same surface of a substrate (156/651.1) {1}

DEFINITION

Classification: 438/FOR.124

Sequential application of etchant material:

Foreign art collection for processes wherein plural etching steps are carried out on the same substrate at different times.