US PATENT SUBCLASS 438 / FOR 119
.~.~ With mechanical deformation, severing, or abrading of a substrate (156/ 645.1)

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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

983  DF  ZENER DIODES {1}
FOR 100  DF  .~ Etching of semiconductor precursor, substrates, and devices used in an electrical function (156/625.1) {17}
FOR 119.~.~ With mechanical deformation, severing, or abrading of a substrate (156/ 645.1)

DEFINITION

Classification: 438/FOR.119

With mechanical deformation, severing, or abrading of a substrate:

Foreign art collection for processes wherein a substrate is subjected to a physical force of sufficient magnitude to cause permanent distortion thereof or removal of material therefrom.