.~ Altering etchability of substrate region by compositional or crystalline modification
DEFINITION
Classification: 438/705
Altering etchability of substrate region by compositional or crystalline modification:
(under subclass 689) Processes wherein the manner in which a semiconductor substrate is etched by a chemical etchant is altered by contacting the substrate prior to etching (a) with a material which alloys or diffuses into a substrate region or (b) by modifying the crystalline structure of a substrate region (e.g., amorphosizing, introducing dislocations, etc.).
