US PATENT SUBCLASS 438 / 611
.~.~ Beam lead formation


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
611.~.~ Beam lead formation


DEFINITION

Classification: 438/611

Beam lead formation:

(under subclass 597) Processes wherein the electrical contact leads extend beyond the edge of the semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:

411, for processes of making an electrically isolated lateral semiconductor structure wherein spaced semiconductor bodies are held in place via beam leads.

461, for processes of dicing a semiconductor substrate which coincidently form beam lead conductors.