US PATENT SUBCLASS 438 / 539
.~.~ Application of pressure to material during fusion

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

510  DF  INTRODUCTION OF CONDUCTIVITY MODIFYING DOPANT INTO SEMICONDUCTIVE MATERIAL {7}
537  DF  .~ Fusing dopant with substrate (i.e., alloy junction) {3}
539.~.~ Application of pressure to material during fusion

DEFINITION

Classification: 438/539

Application of pressure to material during fusion:

(under subclass 537) Processes wherein pressure is applied during the alloying operation.