US PATENT SUBCLASS 438 / 464
.~ With attachment to temporary support or carrier

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

460  DF  SEMICONDUCTOR SUBSTRATE DICING {5}
464.~ With attachment to temporary support or carrier

DEFINITION

Classification: 438/464

With attachment to temporary support or carrier:

(under subclass 460) Process including a step of attaching the semiconductor substrate to a temporary holder to facilitate the handling of the substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:

106, for a process of packaging (e.g., mounting, encapsulating, etc.) a semiconductor substrate by securing the same to a support (i.e., a mounting) or treating a packaged semiconductor device.