US PATENT SUBCLASS 438 / 462
.~ Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

460  DF  SEMICONDUCTOR SUBSTRATE DICING {5}
462.~ Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)


DEFINITION

Classification: 438/462

Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.):

(under subclass 460) Process wherein the region of the semiconductor substrate delineating the separating boundary between adjacent die possesses a specified structure.

(1) Note. The specified structure may serve no function in the separation of the substrate into plural bodies (e.g., alignment marks, etc.) or may facilitate the separation operation (e.g., plural grooves of specified relationship, a trench having significant sidewall structure, etc.).

(2) Note. A scribe groove, per se, or plural scribe lines intersecting in such a way so as to form chips of a certain shape (e.g., trapezoidal, etc.) are not considered proper herein.