(under subclass 460) Process for separating a semiconductor substrate into plural individual bodies wherein the resultant bodies possess electrical leads which extend beyond the edges of the body (i.e., cantilevered).
SEE OR SEARCH THIS CLASS, SUBCLASS:
411, for a process of making laterally spaced isolated semiconductor structure wherein self-supporting electrodes hold plural semiconductor bodies in spaced relationship to each other.
SEE OR SEARCH CLASS
29, Metal Working,
827, for beam lead device manufacture wherein an electrically conductive body is mounted in a cantilever fashion to an electrical device.
