.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
DEFINITION
Classification: 438/15
Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:
(under subclass 14) Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).
