US PATENT SUBCLASS 438 / 15
.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor


Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use



438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

14  DF  WITH MEASURING OR TESTING {3}
15.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor


DEFINITION

Classification: 438/15

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:

(under subclass 14) Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).