US PATENT SUBCLASS 438 / 119
.~.~ Electrically conductive adhesive

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
118  DF  .~ Including adhesive bonding step {1}
119.~.~ Electrically conductive adhesive

DEFINITION

Classification: 438/119

Electrically conductive adhesive:

(under subclass 118) Process wherein the nonmetallic bonding material is electrically conductive.

(1) Note. The nonmetallic bonding material may possess particulate metal dispersed in the nonmetallic adhesive binder to render the composition electrically conductive.