(under subclass 106) Process for packaging a semiconductor substrate including a step of joining the semiconductor substrate to a another body by nonmetallic bonding.
(1) Note. See Lines With Other Classes, "Packaging (E.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor" above. Also see the search notes below.
SEE OR SEARCH CLASS
156, Adhesive Bonding and Miscellaneous Chemical Manufacture,
60+, for a step of surface bonding or assembly therefor, and the Class 156 definition for special lines to Class 29, Metal Working.
