US PATENT SUBCLASS 438 / 108
.~.~ Flip-chip-type assembly

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
107  DF  .~ Assembly of plural semiconductive substrates each possessing electrical device {2}
108.~.~ Flip-chip-type assembly

DEFINITION

Classification: 438/108

Flip-chip-type assembly:

(under subclass 107) Process wherein a semiconductive substrate which has electric contacts on the top side thereof is flipped to juxtapose the contacts in face-to-face orientation with a substrate which has matching electrical contacts prior to bonding.