US PATENT SUBCLASS 438 / 107
.~ Assembly of plural semiconductive substrates each possessing electrical device

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
107.~ Assembly of plural semiconductive substrates each possessing electrical device {2}
108  DF  .~.~> Flip-chip-type assembly
109  DF  .~.~> Stacked array (e.g., rectifier, etc.)

DEFINITION

Classification: 438/107

Assembly of plural semiconductive substrates each possessing electrical device:

(under subclass 106) Process wherein plural semiconductive substrates are combined into a hybrid construction or secured onto a common support.

SEE OR SEARCH THIS CLASS, SUBCLASS:

455, for a nonpackaging process of joining or bonding plural semiconductive substrates wherein none of the semiconductive substrates are intended to function as a terminal, elongated conductor, or support.