US PATENT SUBCLASS 427 / 570
.~.~ Utilizing plasma with other nonionizing energy sources

Current as of: June, 1999
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427 /   HD   COATING PROCESSES

457  DF  DIRECT APPLICATION OF ELECTRICAL, MAGNETIC, WAVE, OR PARTICULATE ENERGY {15}
569  DF  .~ Plasma (e.g., corona, glow discharge, cold plasma, etc.) {5}
570.~.~ Utilizing plasma with other nonionizing energy sources {4}
571  DF  .~.~.~> With magnetic enhancement
572  DF  .~.~.~> Light as energy source
573  DF  .~.~.~> With heated substrate
574  DF  .~.~.~> Silicon containing coating

DEFINITION

Classification: 427/570

Utilizing plasma with other nonionizing energy sources:

(under subclass 569) Processes which utilize (1) a plasma and (2) a secondary energy source at any stage in the plasma coating process for any reason, other than initiating or generating the plasma.

(1) Note. This subclass includes subject matter with dual activation (reaction energized sites) wherein one of the energy sources must be plasma (e.g., plasma plus infrared heat energy, etc.).

(2) Note. Lacking an indication to the contrary, it will be assumed that a disclosed energy source is the plasma initiating source, unless it is specified that the energy

source is utilized for a purpose other than initiating the plasma.