374 / | HD | THERMAL MEASURING AND TESTING |
|
100 | DF | TEMPERATURE MEASUREMENT (E.G., THERMOMETER) {13} |
163 | | .~ By electrical or magnetic heat sensor {13} |
164 | DF | .~.~> With preheated sensing probe |
165 | DF | .~.~> With heat exchanger or conductor |
166 | DF | .~.~> At plural zones {1} |
168 | DF | .~.~> With self-rebalancing arrangement (e.g., servo-potentiometer, thermal link) |
169 | DF | .~.~> With thermal lag compensation |
170 | DF | .~.~> Digital output {1} |
172 | DF | .~.~> With compensation for sensor nonlinearity or lead impedance {1} |
174 | DF | .~.~> By conductive fluid or work function within sensor (e.g., ionization) |
175 | DF | .~.~> Thermal noise generated in conductor |
176 | DF | .~.~> Including sensor having hysteresis or cryogenic property (e.g., ferromagnetism, superconductivity) {1} |
178 | DF | .~.~> By barrier layer sensing element (e.g., semiconductor junction) |
179 | DF | .~.~> By thermoelectric potential generator (e.g., thermocouple) {3} |
183 | DF | .~.~> By current modifying sensor {2} |