| 374 / | HD | THERMAL MEASURING AND TESTING |
|
| 100 | DF | TEMPERATURE MEASUREMENT (E.G., THERMOMETER) {13} |
| 163 |  | .~ By electrical or magnetic heat sensor {13} |
| 164 | DF | .~.~> With preheated sensing probe |
| 165 | DF | .~.~> With heat exchanger or conductor |
| 166 | DF | .~.~> At plural zones {1} |
| 168 | DF | .~.~> With self-rebalancing arrangement (e.g., servo-potentiometer, thermal link) |
| 169 | DF | .~.~> With thermal lag compensation |
| 170 | DF | .~.~> Digital output {1} |
| 172 | DF | .~.~> With compensation for sensor nonlinearity or lead impedance {1} |
| 174 | DF | .~.~> By conductive fluid or work function within sensor (e.g., ionization) |
| 175 | DF | .~.~> Thermal noise generated in conductor |
| 176 | DF | .~.~> Including sensor having hysteresis or cryogenic property (e.g., ferromagnetism, superconductivity) {1} |
| 178 | DF | .~.~> By barrier layer sensing element (e.g., semiconductor junction) |
| 179 | DF | .~.~> By thermoelectric potential generator (e.g., thermocouple) {3} |
| 183 | DF | .~.~> By current modifying sensor {2} |