US PATENT SUBCLASS 361 / 718
.~.~.~.~.~ For integrated circuit

Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
688  DF  .~.~ With cooling means {2}
704  DF  .~.~.~ Thermal conduction {8}
717  DF  .~.~.~.~ For active solid state devices {1}
718.~.~.~.~.~ For integrated circuit {1}
719  DF  .~.~.~.~.~.~> Circuit board mounted

DEFINITION

Classification: 361/718

For integrated circuit:

(under subclass 717) Subject matter wherein the heat is conducted from an electrical network composed of two or more circuit elements inextricably bound on a single semiconductor substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:

764, for integrated circuit within printed circuit board without cooling means.

SEE OR SEARCH CLASS

257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), appropriate subclass for integrated circuits, per se.