US PATENT SUBCLASS 361 / 704
.~.~.~ Thermal conduction

Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
688  DF  .~.~ With cooling means {2}
704.~.~.~ Thermal conduction {8}
705  DF  .~.~.~.~> By specific coating {1}
707  DF  .~.~.~.~> Through support means {4}
714  DF  .~.~.~.~> Through component housing
715  DF  .~.~.~.~> For module {1}
717  DF  .~.~.~.~> For active solid state devices {1}
720  DF  .~.~.~.~> For printed circuit board {1}
722  DF  .~.~.~.~> For electronic circuit
723  DF  .~.~.~.~> For lead frame

DEFINITION

Classification: 361/704

Thermal conduction:

(under subclass 688) Subject matter wherein the electronic system or device is cooled by transmitting heat through a heat transmitting member.

SEE OR SEARCH THIS CLASS, SUBCLASS:

707, for thermal conduction through the component support means.

SEE OR SEARCH CLASS

174, Electricity: Conductors and Insulators, appropriate subclass for heat conducting members (heat sinks), per se.