US PATENT SUBCLASS 361 / 723
.~.~.~.~ For lead frame

Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
688  DF  .~.~ With cooling means {2}
704  DF  .~.~.~ Thermal conduction {8}
723.~.~.~.~ For lead frame

DEFINITION

Classification: 361/723

For lead frame:

(under subclass 704) Subject matter wherein a metal skeletal structure is utilized to support diverse components and having heat conduction as cooling means.

(1) Note. Lead frame in Class 257 is defined as a semiconductor device combined with housing wherein the contact is part of a network of leads suspended from a common lead.

SEE OR SEARCH THIS CLASS, SUBCLASS:

813, for lead frame utilized to support diverse components and having no cooling means.

SEE OR SEARCH CLASS

174, Electricity: Conductors and Insulators,

52.4, for lead frame devices with housing means but having no claimed characteristics limiting particular characters of electrical equipment classifiable in other main classes.