US PATENT SUBCLASS 361 / 717
.~.~.~.~ For active solid state devices

Current as of: June, 1999
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361 /   HD   ELECTRICITY: ELECTRICAL SYSTEMS AND DEVICES

600  DF  HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS {11}
679  DF  .~ For electronic systems and devices {15}
688  DF  .~.~ With cooling means {2}
704  DF  .~.~.~ Thermal conduction {8}
717.~.~.~.~ For active solid state devices {1}
718  DF  .~.~.~.~.~> For integrated circuit {1}

DEFINITION

Classification: 361/717

For active solid state devices:

(under subclass 704) Subject matter wherein the heat is conducted from semiconductive devices.

SEE OR SEARCH THIS CLASS, SUBCLASS:

764, for integrated circuit within printed circuit board with no cooling means and having no structural details to an active solid state device.

783, for semiconductive device connected to printed circuit board with no cooling means and having no structural details to semiconductive device.

820, for electronic system or device support/housing and having at least one semiconductor device as a component without cooling means.

SEE OR SEARCH CLASS

257, Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), 712+, for cooling of semiconductor device wherein (a) the housing is for an active solid-state device, details of which are positively recited in the claims or (b) wherein the recited housing is necessary to make a usable active solid-state device.