US PATENT SUBCLASS 356 / 237.5
.~.~ On patterned or topographical surface (e.g., wafer, mask, circuit board)


Current as of: June, 1999
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356 /   HD   OPTICS: MEASURING AND TESTING

237.1  DF  INSPECTION OF FLAWS OR IMPURITIES {6}
237.2  DF  .~ Surface condition {2}
237.5.~.~ On patterned or topographical surface (e.g., wafer, mask, circuit board)


DEFINITION

Classification: 356/237.5

On patterned or topos:graphical surface (e.g., wafer, mask, circuit board):

(under subclass 237.2) Inspection of surface condition wherein the inspected article further includes a motif or raised three dimensional configuration.

SEE OR SEARCH THIS CLASS, SUBCLASS:

243.7, for a standard for a surface further comprising texture.

SEE OR SEARCH CLASS

250, Radiant Energy,

559.44, for a photocell having a circuit producing an output indicating the presence or absence of a marking, pattern, or indicia on the surface of the material.