US PATENT SUBCLASS 257 / 786
.~ Configuration or pattern of bonds

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
786.~ Configuration or pattern of bonds

DEFINITION

Classification: 257/786

Configuration or pattern of bonds:

(under subclass 734) Subject matter wherein the electrical contact, lead or bond, has a specific configuration or pattern.

SEE OR SEARCH THIS CLASS, SUBCLASS:

459, for light activated devices with particular bonding pad arrangement.

625, for mesa structure semiconductor device bonded to heat sink or thick electrical conductor.