US PATENT SUBCLASS 257 / 780
.~ Ball or nail head type contact, lead or bond

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
780.~ Ball or nail head type contact, lead or bond {1}
781  DF  .~.~> Layered contact, lead or bond

DEFINITION

Classification: 257/780

Ball or nail head type contact, lead, or bond:

(under subclass 734) Subject matter wherein a contact, lead, or bond is in the form of a wire having an end for connection to the semiconductor which is in the shape of a ball or nail head.

SEE OR SEARCH THIS CLASS, SUBCLASS:

738, for ball shaped bump contacts.