US PATENT SUBCLASS 257 / 779
.~ Solder wettable contact, lead or bond

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
779.~ Solder wettable contact, lead or bond

DEFINITION

Classification: 257/779

Solder wettable contact, lead, or bond:

(under subclass 734) Subject matter wherein an electrical contact or lead has a surface to which solder will readily adhere.