US PATENT SUBCLASS 257 / 777
.~ Chip mounted on chip

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
777.~ Chip mounted on chip

DEFINITION

Classification: 257/777

Chip mounted on chip:

(under subclass 734) Subject matter wherein a semiconductor substrate of an active solid-state device is electrically

connected to, and positioned on, another semiconductor substrate.

SEE OR SEARCH CLASS

361, Electricity: Electrical Systems and Devices,

760+, for plural modules or means of connection of components to a printed circuit board.