US PATENT SUBCLASS 257 / 774
.~.~ Via (interconnection hole) shape

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
773  DF  .~ Of specified configuration {3}
774.~.~ Via (interconnection hole) shape

DEFINITION

Classification: 257/774

Via (interconnection hole) shape:

(under subclass 773) Subject matter wherein the shape or configuration of an electrical contact or lead is determined by the shape of a hole through an insulating layer through which the contact extends.