US PATENT SUBCLASS 257 / 772
.~.~ Solder composition

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
741  DF  .~ Of specified material other than unalloyed aluminum {10}
772.~.~ Solder composition

DEFINITION

Classification: 257/772

Solder composition:

(under subclass 741) Subject matter wherein the specific contact or lead material is a solder composition (i.e., a metal or metallic alloy that melts at relatively low temperatures).

(1) Note. Solder is normally used to join metals with higher melting points than the solder composition.