US PATENT SUBCLASS 257 / 711
.~.~ With raised portion of base for mounting semiconductor chip

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
708  DF  .~ Entirely of metal except for feedthrough {3}
711.~.~ With raised portion of base for mounting semiconductor chip

DEFINITION

Classification: 257/711

With raised portion of base for mounting semiconductor chip:

(under subclass 708) Subject matter wherein a portion of the base is raised above the rest of the base and the raised portion provides a base on which to mount a semiconductor chip with an active solid-state device therein or thereon.