US PATENT SUBCLASS 257 / 619
.~ With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

618  DF  PHYSICAL CONFIGURATION OF SEMICONDUCTOR (E.G., MESA, BEVEL, GROOVE, ETC.) {6}
619.~ With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support)

DEFINITION

Classification: 257/619

With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support):

(under subclass 618) Subject matter wherein the device has a thin active central configuration which is surrounded by a thicker inactive shoulder region (e.g., for mechanical support).