US PATENT SUBCLASS 216 / 35
.~.~ Bonding of preform of metal or an alloy thereof to a preform of a nonmetal

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

33  DF  ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.) {2}
34  DF  .~ Etching improves or promotes adherence of preforms being bonded {1}
35.~.~ Bonding of preform of metal or an alloy thereof to a preform of a nonmetal

DEFINITION

Classification: 216/35

Bonding of preform of metal or an alloy thereof to a preform of a nonmetal:

(under subclass 34) Process of improving or promoting the adherence or bonding of a preform of metal or an alloy thereof to a nonmetal preform.