US PATENT SUBCLASS 205 / 167
.~.~.~.~ Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)


Current as of: June, 1999
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205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
159  DF  .~ Coating predominantly nonmetal substrate {4}
164  DF  .~.~ Synthetic resin substrate {2}
166  DF  .~.~.~ Conductive material applied to substrate by painting, spraying, or immersion {1}
167.~.~.~.~ Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.) {2}
168  DF  .~.~.~.~.~> Resin contains etchable filler
169  DF  .~.~.~.~.~> Conductive material is copper or nickel


DEFINITION

Classification: 205/167

Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.):

(under subclass 164) Subject matter wherein conductive

material is applied to the substrate by plating from a bath containing metal ions and a reducing agent before the substrate is electrolytically coated.