US PATENT SUBCLASS 205 / 167
.~.~.~.~ Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.)

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
159  DF  .~ Coating predominantly nonmetal substrate {4}
164  DF  .~.~ Synthetic resin substrate {2}
166  DF  .~.~.~ Conductive material applied to substrate by painting, spraying, or immersion {1}
167.~.~.~.~ Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.) {2}
168  DF  .~.~.~.~.~> Resin contains etchable filler
169  DF  .~.~.~.~.~> Conductive material is copper or nickel

DEFINITION

Classification: 205/167

Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.):

(under subclass 164) Subject matter wherein conductive

material is applied to the substrate by plating from a bath containing metal ions and a reducing agent before the substrate is electrolytically coated.