US PATENT SUBCLASS 205 / 169
.~.~.~.~.~ Conductive material is copper or nickel


Current as of: June, 1999
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205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
159  DF  .~ Coating predominantly nonmetal substrate {4}
164  DF  .~.~ Synthetic resin substrate {2}
166  DF  .~.~.~ Conductive material applied to substrate by painting, spraying, or immersion {1}
167  DF  .~.~.~.~ Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.) {2}
169.~.~.~.~.~ Conductive material is copper or nickel


DEFINITION

Classification: 205/169

Conductive material is copper or nickel:

(under subclass 167) Subject matter wherein the major or predominant constituent of the conductive material is copper or nickel.