US PATENT SUBCLASS 205 / 168
.~.~.~.~.~ Resin contains etchable filler


Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use



205 /   HD   ELECTROLYSIS: PROCESSES, COMPOSITIONS USED THEREIN, AND METHODS OF PREPARING THE COMPOSITIONS

80  DF  ELECTROLYTIC COATING (PROCESS, COMPOSITION AND METHOD OF PREPARING COMPOSITION) {42}
159  DF  .~ Coating predominantly nonmetal substrate {4}
164  DF  .~.~ Synthetic resin substrate {2}
166  DF  .~.~.~ Conductive material applied to substrate by painting, spraying, or immersion {1}
167  DF  .~.~.~.~ Conductive material applied to substrate by plating from bath containing metal ions and reducing agent (e.g., electroless plating, etc.) {2}
168.~.~.~.~.~ Resin contains etchable filler


DEFINITION

Classification: 205/168

Resin contains etchable filler:

(under subclass 167) Subject matter wherein the synthetic resin contains a filler material which may be at least partially removed by etching.