US PATENT SUBCLASS 204 / 192.34
.~.~.~ Ion beam etching (e.g., ion milling, etc.)

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.32  DF  .~.~ Sputter etching {3}
192.34.~.~.~ Ion beam etching (e.g., ion milling, etc.)

DEFINITION

Classification: 204/192.34

Ion beam etching (e.g., ion milling, etc.):

(under subclass 192.32) Processes wherein a beam of ions generated by an ion source remote from the substrate is employed to sputter material from the substrate.