US PATENT SUBCLASS 204 / 192.33
.~.~.~ Measuring or testing (e.g., of operating parameters, end point determination, etc.)

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.32  DF  .~.~ Sputter etching {3}
192.33.~.~.~ Measuring or testing (e.g., of operating parameters, end point determination, etc.)

DEFINITION

Classification: 204/192.33

Measuring or treating (e.g., operating parameters, end point determination etc.):

(under subclass 192.32) Processes wherein at least one characteristic of the etching process or the substrate being etched is measured or tested, e.g., operating parameters, and point determination, etc.