US PATENT SUBCLASS 149 / 19.1
.~.~.~ Organic material contains polysaccharide resin or synthetic resin

Current as of: June, 1999
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149 /   HD   EXPLOSIVE AND THERMIC COMPOSITIONS OR CHARGES

2  DF  STRUCTURE OR ARRANGEMENT OF COMPONENT OR PRODUCT {4}
17  DF  .~ Solid particles dispersed in solid solution or matrix {1}
18  DF  .~.~ Continuous phase contains organic material {2}
19.1.~.~.~ Organic material contains polysaccharide resin or synthetic resin {8}
19.2  DF  .~.~.~.~> Including organometallic or organo (silicon/boron) compound
19.3  DF  .~.~.~.~> Resin contains fluorine, bromine or iodine
19.4  DF  .~.~.~.~> Polyurethane
19.5  DF  .~.~.~.~> Polyester
19.6  DF  .~.~.~.~> Resin contains oxirane groups or interunit ether linkages {1}
19.9  DF  .~.~.~.~> Polymerized conjugated diene
19.91  DF  .~.~.~.~> Polymerized ethylenically unsaturated compound
19.92  DF  .~.~.~.~> Process {1}

DEFINITION

Classification: 149/19.1

(under subclass 18) Products wherein the organic material is a synthetic resin or a polysaccharide resin or a derivative of a polysaccharide resin.

SEE OR SEARCH CLASS

516, Colloid Systems and Wetting Agents; Subcombinations Thereof; Processes of Making, Stabilizing, Breaking, or Inhibiting,

98+, for colloid systems of continuous or semicontinuous solid phase with discontinuous liquid phase (gels, pastes, flocs, coagulates) or agents for such systems or making or stabilizing such systems or agents, when generically claimed or when there is no hierarchically superior provision in the USPC for the specifically claimed art.