US PATENT SUBCLASS 149 / 19.2
.~.~.~.~ Including organometallic or organo (silicon/boron) compound

Current as of: June, 1999
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149 /   HD   EXPLOSIVE AND THERMIC COMPOSITIONS OR CHARGES

2  DF  STRUCTURE OR ARRANGEMENT OF COMPONENT OR PRODUCT {4}
17  DF  .~ Solid particles dispersed in solid solution or matrix {1}
18  DF  .~.~ Continuous phase contains organic material {2}
19.1  DF  .~.~.~ Organic material contains polysaccharide resin or synthetic resin {8}
19.2.~.~.~.~ Including organometallic or organo (silicon/boron) compound

DEFINITION

Classification: 149/19.2

(under subclass 19.1) Products in which the organic material comprises a metal or a silicon or a boron atom bonded directly to a carbon atom.

SEE OR SEARCH CLASS

516, Colloid Systems and Wetting Agents; Subcombinations Thereof; Processes of Making, Stabilizing, Breaking, or Inhibiting,

98+, for colloid systems of continuous or semicontinuous solid phase with discontinuous liquid phase (gels, pastes, flocs, coagulates) or agents for such systems or making or stabilizing such systems or agents, when generically claimed or when there is no hierarchically superior provision in the USPC for the specifically claimed art.