(under subclass 95) Process wherein an ionic species is directed at a substrate with sufficient energy to be deposited within the microstructure or interstitial spaces of a metal substrate.
SEE OR SEARCH THIS CLASS, SUBCLASS:
206+, for ion implantation of carbon or nitrogen which combines with the metal or metal substrate to form a coating thereon or to affect a composition change throughout.
SEE OR SEARCH CLASS
204, Chemistry: Electrical and Wave Energy, appropriate subclasses for processes of coating a substrate utilizing ionic bombardment and sputtering from a target wherein the sputtered material becomes deposited on a metal substrate to form a coating thereon.
(1) Note. There is no intent to take sputter coating in this particular subclass of Class 148.
250, Radiant Energy,
492.3, for processes of, per se, ion or electron beam irradiation. 427, Coating Processes, appropriate subclasses for processes of ion implanting, per se, or ion plating of the near surface region of substrates in general to provide a coating thereon.
(1) Note. There is no intent to take ion plating in this subclass of Class 148.
(2) Note. Class 427 will take simultaneous ion implantation and diffusion as proper for Class 427 if coating is present. However, inclusion of a separate step which by itself would be classifiable in Class 148 is enough to place the combination in Class 148. Moreover, a combination of a metal working step proper for one of the metal working classes and ion implantation for coating purposes will be proper for this subclass. Ion implantation throughout a metal substrate is
not merely coating for Class 427 and since microstructural change is involved, placement will be considered proper for Class 148.
438, Semiconductor Device Manufacturing: Process, appropriate subclasses for ion implantation of a semiconductor substrate (e.g., for gettering, amorphousizing, or doping of semiconductor material to alter electrical characteristics, etc.).
