US PATENT SUBCLASS 588 / 207
.~.~ Halogen attached directly to benzene ring by nonionic bonding (e.g., PCB's)

Current as of: June, 1999
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588 /   HD   HAZARDOUS OR TOXIC WASTE DESTRUCTION OR CONTAINMENT

205  DF  ORGANIC SUBSTANCE DESTROYED {8}
206  DF  .~ Halogen attached directly to carbon by nonionic bonding {3}
207.~.~ Halogen attached directly to benzene ring by nonionic bonding (e.g., PCB's) {3}
208  DF  .~.~.~> Hydropyrolysis or destructive steam gasification
209  DF  .~.~.~> Heating or vacuum used to drive off or produce a volatile substance
210  DF  .~.~.~> Using ionizing radiation, electrical energy, magnetic force, radiation, or sonic energy (e.g., laser, plasma, microwave, or ultrasonic) {1}

DEFINITION

Classification: 588/207

Halogen attached directly to benzene ring by nonionic bonding (e.g., PCB's):

(under subclass 206) Processes wherein the halogenated organic substance destroyed or converted includes a compound which contains an atom of halogen attached directly to a benzene ring by nonionic bonding.