US PATENT SUBCLASS 588 / 206
.~ Halogen attached directly to carbon by nonionic bonding

Current as of: June, 1999
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588 /   HD   HAZARDOUS OR TOXIC WASTE DESTRUCTION OR CONTAINMENT

205  DF  ORGANIC SUBSTANCE DESTROYED {8}
206.~ Halogen attached directly to carbon by nonionic bonding {3}
207  DF  .~.~> Halogen attached directly to benzene ring by nonionic bonding (e.g., PCB's) {3}
212  DF  .~.~> Using ionizing radiation, electrical energy, magnetic force, radiaiton, or sonic energy (e.g., laser, plasma, microwave, or ultrasonic)
213  DF  .~.~> Heating or vacuum used to drive off or produce a volatile substance (e.g., hydropyrolysis or destructive steam gasification) {1}

DEFINITION

Classification: 588/206

Halogen attached directly to carbon by nonionic bonding:

(under subclass 205) Process wherein the organic substance destroyed or converted includes a compound which contains an atom of halogen attached directly to an atom of carbon by nonionic bonding.

(1) Note. The substances falling in this subclass are materials that are generally aliphatic and have the halogen directly attached to nonaromatic carbon.

SEE OR SEARCH CLASS

568, Organic Compounds, appropriate subclasses for the production of halogen containing organic compounds.

570, Organic Compounds, appropriate subclasses for the production of halogen containing organic compounds.

585, Chemistry of Hydrocarbon Compounds, for process employing halogen containing compounds in the manufacture of hydrocarbons.