US PATENT SUBCLASS 53 / 81
.~.~ Solder and/or flux deposit only

Current as of: June, 1999
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53 /   HD   PACKAGE MAKING

79  DF  GAS FILLING AND/OR EVACUATING OF RECEPTACLE AND CLOSING {5}
80  DF  .~ Including soldering means {2}
81.~.~ Solder and/or flux deposit only

DEFINITION

Classification: 53/81

(under subclass 80) Apparatus limited to the application or juxtapositioning of solder and/or flux.

SEE OR SEARCH CLASS

228, Metal Fusion Bonding,

14, and 33 +for apparatus for applying flux or solder in a metal-fusion bonding operation.